Intel launched new Xeon 6 processors built for high-density AI work in data centers. Intel CEO Pat Gelsinger emphasized performance and power efficiency as he introduced the next-gen Xeon, and said that the Gaudi 3 chips for AI model training and deployment that were released two months ago are less expensive than comparable silicon from Intel rivals. “Intel is one of the only companies in the world innovating across the full spectrum of the AI market opportunity — from semiconductor manufacturing to PC, network, edge and data center systems,” Gelsinger said, embracing open standards during his keynote at Computex. Read more

Qualcomm is expanding beyond mobile and into the desktop market in a big way, bringing its AI-enabled Snapdragon X series chips to “all PC form factors,” CEO Cristiano Amon said onstage at Computex this week. Under the theme of “the PC reborn,” Amon said the Snapdragon X Elite and Snapdragon X Plus processors powering Microsoft’s Copilot+ PC experiences are also upping their mobile game. In addition to improving AI experiences with “the world’s fastest and most efficient NPU for laptops,” the chips can deliver “up to multiple days of battery life,” unfettered those on the go from power outlets. Read more

Magic Leap and Google have entered into a strategic partnership to develop augmented reality solutions, combining Magic Leap’s optics expertise with Google’s technology platforms. “By combining efforts, we can foster the future of the XR ecosystem with unique and innovative product offerings.” Google VP and General Manager of AR/XR Shahram Izadi said of the union, seen by some as effort by Google to jumpstart an XR business that could someday be competitive with offerings from Meta, Microsoft and now Apple. The company was an early mover in the space, with Google Cardboard and Google Glass, but dropped out. Read more

Nvidia President and CEO Jensen Huang said the company will be upgrading its AI accelerators annually, with the Blackwell Ultra processor coming in 2025 and a next-generation platform called Rubin that is still in development planned for 2026. Rubin AI will utilize a type of high-bandwidth memory called HBM4 that addresses a bottleneck that has stifled the production of AI accelerators. Huang shared the news from Taiwan, where he delivered a keynote at the Computex trade show. Nvidia Inference Microservices were another focus, allowing AI applications to be deployed in minutes instead of weeks, Huang said. Read more

At Computex Taipei this week, AMD revealed its AMD Ryzen AI 300 Series third generation of AI-enabled mobile processors for next-generation laptops. It joins Intel’s upcoming Lunar Lake and the Snapdragon X platform from Qualcomm among the chips vying for a place in the exploding market for artificial intelligence processing, an area dominated by Nvidia. However, with AI PCs and laptops just hitting the market that field is somewhat in play. The Ryzen AI 300s are among those that will be used to power laptops equipped with Microsoft Copilot+ AI. At Computex, AMD also unveiled its Ryzen 9000 Series processors for desktop PCs. Read more