HP announced its Copilot+ mini PC and all-in-one desktop PCs at CES 2025 in Las Vegas last week. Rather than powering the new devices with Qualcomm chips, HP chose AMD’s Ryzen AI Max chips for the company’s new Z2 Mini G1a — the “world’s most powerful mini workstation” — and Intel Core Ultra 200V processors for the OmniStudio X all-in-one, described by some as a legitimate iMac Pro competitor. The Intel processors have enough power to support Microsoft Copilot+ PC features for the desktop, while the Z2 Mini G1a is also a Copilot+ PC, touting the AI-powered features, image generation, and editing tools available in Windows 11. Continue reading CES: HP Mini PC, All-in-One Desktop Feature Copilot+ AI Tech

The new Asus Zenbook A14 laptop leads the company’s Copilot+ line expansion. Powered by the latest Qualcomm Snapdragon X processor, Asus says its battery will last up to 32 hours. And at just 2.18 pounds, the “featherweight” device is drawing comparisons to Apple’s MacBook Air — but at a more affordable price. The Zenbook A14 will start at $1,099.99 when it hits the market later this month in gray with a base 8-core processor featuring 32GB of RAM and 1TB SSD. The model sports a 14-inch OLED display with 1920×1200 resolution reaching 600 nits of peak brightness at 60Hz. Continue reading CES: Lightweight Asus Zenbook Laptop Takes on MacBook Air

Lenovo announced the Legion Go S, the first device outside of Valve’s own hardware to officially ship with SteamOS. Launching in May 2025, the $499 handheld gaming PC joins Valve’s Steam Deck in the lower-price segment of the PC handheld market. The device features an 8-inch display with 120Hz variable refresh rate and runs on a Lenovo-exclusive AMD Ryzen Z2 Go chip. Lenovo plans to release both SteamOS and Windows versions, with the Windows variant arriving first. The device introduces several technical improvements over its predecessor, replacing detachable controllers with an integrated grip design. Continue reading CES: Lenovo Reveals Third-Party SteamOS Gaming Handheld

CES 2025, taking place the week of January 5 in Las Vegas, is expected to focus on artificial intelligence, unveiling a wave of innovative offerings — whether practical, visionary or experimental. As we stand on the brink of transformative change, it’s worth recalling that early AI models often fell short when they attempted to mimic human methods. As we approach CES in service to the entertainment industry, we’ll be most interested in products that use this constant advance to assist and amplify human potential. Media applications that impact the next generation of compelling stories, production techniques, and consumer experiences will be of most interest. Continue reading CES Preview: Standing on the Brink of Transformative Change

Ayar Labs, which develops optical interconnect chips for large-scale AI workloads, has secured $155 million in financing, including from competing processor companies Nvidia, Intel and AMD. Founded in 2017, the Silicon Valley-based company is pursuing a different processing path — combining photonic elements with electronic circuits on each chip for what it says provides faster, more efficient processing for artificial intelligence and high-performance computing. “This brings the company’s total funding to $370 million and raises the company’s valuation to above $1 billion,” Ayar notes, adding that the new funding allows the company to scale its optical I/O tech. Continue reading Nvidia, Intel and AMD Invest in AI Chiplet Developer Ayar Labs

Competing chipmakers Intel and AMD are joining forces on an advisory group for x86 computing. Invented by Intel and launched in 1978, the x86 architecture remains one of the most widely used platforms in the world, but has already been displaced by ARM in mobile, and is now fending off a challenge from that architecture in the AI space. Also participating in the x86 advisory are Broadcom, Dell, Google, Hewlett Packard Enterprise, HP Inc., Lenovo, Meta, Microsoft, Oracle and Red Hat, joined by tech luminaries Linus Torvalds, inventor of Linux, and Epic Games founder and CEO Tim Sweeney. Continue reading Rivals Intel and AMD Team Up to Launch x86 Advisory Group

Intel has released the second iteration of AI Playground, an app it debuted this summer as “a user-friendly AI starter app” designed to simplify artificial intelligence on Intel AI PCs. This latest version works with the new line of Intel Core Ultra 200V series processors, designed for AI under the codename Lunar Lake. The idea is to help those using Intel PCs get comfortable using AI functionality without any special account, or even an Internet connection. Intel also launched two new artificial intelligence chips, the Xeon 6 CPU and Gaudi 3 AI accelerator. Continue reading Intel Updates AI Playground App and Launches New AI Chips

IBM is the first cloud customer for Intel’s Gaudi 3 AI accelerator chip, which it will make available in early 2025. The Gaudi 3 will be available for hybrid and on-site environments via the IBM Cloud, as part of Watsonx AI and on IBM data platforms. Gaudi 3, which began shipping in Q2 and is expected to go into mass production later this year, is IBM’s AI challenger to GPU accelerators from Nvidia and AMD, the latter having in January begun shipping its own HPC solution, the MI300X. Unlike that chip and Nvidia’s Hopper H100 and more recent Blackwell B200, the Gaudi 3 is not a GPU, but built on an architecture specifically for inference and deep learning. Continue reading IBM Cloud Is First to Widely Implement Intel Gaudi 3 AI Chips

Samsung Electronics, which teased a glasses-free 3D gaming monitor at CES in January, officially announced the scheduled release of two versions at Gamescom last week. Both sizes employ light field display (LFD) technology to create what Samsung calls “lifelike 3D images” from 2D content by using a lenticular lens on the front panel. “Combined with Eye Tracking and View Mapping technology, Odyssey 3D ensures an optimized 3D experience without the need for separate 3D glasses,” according to Samsung. A built-in stereo camera monitors the movement of both eyes while proprietary View Mapping continuously adjusts the image to fuel depth perception. Continue reading Samsung Set to Release Glasses-Free Odyssey 3D Monitors

California-based semiconductor manufacturer AMD is looking to take on Nvidia for a bigger share of business from the artificial intelligence boom. AMD plans to purchase data center equipment maker ZT Systems in a cash and stock deal that values the company at $4.9 billion. The deal, which is subject to regulatory approval, is part of AMD’s goal of offering a wider selection of chips, software and system designs to big data enterprise clients such as Microsoft, Google, Meta Platforms and Apple. Privately held ZT Systems, based in New Jersey, makes gear and server solutions for cloud computing and related infrastructure. Continue reading AMD Buying ZT Systems to Expand Data Center Capabilities

Rene Haas, CEO of UK chip designer Arm Holdings, thinks his company’s platform architecture could nab as much as 50 percent of the Windows PC market by 2030. That would essentially be a 400 percent leap from its current 11 percent share in a market dominated by Intel’s x86 design. Because Arm was developed for smartphones, it was driven by energy efficiency, an approach that is paying off in the era of power-hungry AI applications. Now the technology is being used for the first wave of Microsoft Copilot+ Windows laptops, and Arm has also set its sights on desktop PCs. Continue reading Arm CEO Says Company Aims to Capture Half of PC Market

Intel launched new Xeon 6 processors built for high-density AI work in data centers. Intel CEO Pat Gelsinger emphasized performance and power efficiency as he introduced the next-gen Xeon, and said that the Gaudi 3 chips for AI model training and deployment that were released two months ago are less expensive than comparable silicon from Intel rivals. “Intel is one of the only companies in the world innovating across the full spectrum of the AI market opportunity — from semiconductor manufacturing to PC, network, edge and data center systems,” Gelsinger said, embracing open standards during his keynote at Computex. Continue reading Intel’s Xeon 6 Coming to Data Centers and Lunar Lake to PCs

Nvidia President and CEO Jensen Huang said the company will be upgrading its AI accelerators annually, with the Blackwell Ultra processor coming in 2025 and a next-generation platform called Rubin that is still in development planned for 2026. Rubin AI will utilize a type of high-bandwidth memory called HBM4 that addresses a bottleneck that has stifled the production of AI accelerators. Huang shared the news from Taiwan, where he delivered a keynote at the Computex trade show. Nvidia Inference Microservices were another focus, allowing AI applications to be deployed in minutes instead of weeks, Huang said. Continue reading Nvidia Teases Next-Gen AI Platform Rubin at Computex 2024

At Computex Taipei this week, AMD revealed its AMD Ryzen AI 300 Series third generation of AI-enabled mobile processors for next-generation laptops. It joins Intel’s upcoming Lunar Lake and the Snapdragon X platform from Qualcomm among the chips vying for a place in the exploding market for artificial intelligence processing, an area dominated by Nvidia. However, with AI PCs and laptops just hitting the market that field is somewhat in play. The Ryzen AI 300s are among those that will be used to power laptops equipped with Microsoft Copilot+ AI. At Computex, AMD also unveiled its Ryzen 9000 Series processors for desktop PCs. Continue reading AMD Unveils Its Next-Gen AI Chips in Battle for Market Share

Big Tech players have joined forces to develop a new industry standard to advance high-speed and low latency communication among data centers by coordinating component development. AMD, Broadcom, Cisco, Google, Hewlett Packard Enterprise (HPE), Intel, Meta Platforms and Microsoft are backing the Ultra Accelerator Link (UALink) promoter group. The group plans to define and establish an open industry standard that will enable AI accelerators to communicate more effectively. The UALink aims to create a pathway for system OEMs, IT professionals and system integrators to connect and scale their AI-connected data centers. Continue reading Big Tech Forms a Group to Develop AI Connectivity Standard