Ayar Labs, which develops optical interconnect chips for large-scale AI workloads, has secured $155 million in financing, including from competing processor companies Nvidia, Intel and AMD. Founded in 2017, the Silicon Valley-based company is pursuing a different processing path — combining photonic elements with electronic circuits on each chip for what it says provides faster, more efficient processing for artificial intelligence and high-performance computing. “This brings the company’s total funding to $370 million and raises the company’s valuation to above $1 billion,” Ayar notes, adding that the new funding allows the company to scale its optical I/O tech. Continue reading Nvidia, Intel and AMD Invest in AI Chiplet Developer Ayar Labs

Intel Innovation 2023 provided a springboard for the new Core Ultra generation of chips, known as “Meteor Lake,” which uses the new Intel 4 process and is also the first series to feature a dedicated AI coprocessor, shipping December 14. Intel confirmed its “five-nodes-in-four-years” process technology plan is on schedule. Intel CEO Pat Gelsinger’s keynote demos included “Pike Creek,” introduced as “the world’s first multi-chiplet package using Universal Chiplet Interconnect Express (UCIe) interconnects.” For all that, it was AI that took center stage at the 2-day event in San Jose. Continue reading Intel Touts AI and Debuts New Chip Tech at Innovation Event

Intel has unveiled a new glass substrate technology that it says will “benefit our key players and foundry customers for decades to come.” The result of 10 years and $1 billion in development, the concept substitutes glass for the usual resin in which processors are embedded, enabling greater speed and the ability to accommodate the industry’s move toward packaging numerous “chiplets” into more powerful large processors, a configuration that has proven beneficial for the acceleration that drives artificial intelligence. This technology could potentially vault Intel ahead of competitors, some say. Continue reading Intel Has Plans to Power AI with Glass Substrates for Its Chips

Ten years ago AMD introduced the concept of smaller, interconnected chips that together work like one digital brain. Sometimes called “chiplets,” they’re generally less expensive than building one large chip, and when grouped together into bundles have often outperformed single wafters. In addition to AMD, companies including Apple, Amazon, Intel, IBM and Tesla have embraced the chiplet formula, which leverages advanced packaging technology, an integral part of building advanced semiconductors. Now experts are predicting packaging is going to be even more of a focus in coming years, as the global chip wars heat up. Continue reading Advanced Packaging for ‘Chiplets’ a Focus of CHIPS Funding