Rene Haas, CEO of UK chip designer Arm Holdings, thinks his company’s platform architecture could nab as much as 50 percent of the Windows PC market by 2030. That would essentially be a 400 percent leap from its current 11 percent share in a market dominated by Intel’s x86 design. Because Arm was developed for smartphones, it was driven by energy efficiency, an approach that is paying off in the era of power-hungry AI applications. Now the technology is being used for the first wave of Microsoft Copilot+ Windows laptops, and Arm has also set its sights on desktop PCs. Continue reading Arm CEO Says Company Aims to Capture Half of PC Market

Intel launched new Xeon 6 processors built for high-density AI work in data centers. Intel CEO Pat Gelsinger emphasized performance and power efficiency as he introduced the next-gen Xeon, and said that the Gaudi 3 chips for AI model training and deployment that were released two months ago are less expensive than comparable silicon from Intel rivals. “Intel is one of the only companies in the world innovating across the full spectrum of the AI market opportunity — from semiconductor manufacturing to PC, network, edge and data center systems,” Gelsinger said, embracing open standards during his keynote at Computex. Continue reading Intel’s Xeon 6 Coming to Data Centers and Lunar Lake to PCs

Qualcomm is expanding beyond mobile and into the desktop market in a big way, bringing its AI-enabled Snapdragon X series chips to “all PC form factors,” CEO Cristiano Amon said onstage at Computex this week. Under the theme of “the PC reborn,” Amon said the Snapdragon X Elite and Snapdragon X Plus processors powering Microsoft’s Copilot+ PC experiences are also upping their mobile game. In addition to improving AI experiences with “the world’s fastest and most efficient NPU for laptops,” the chips can deliver “up to multiple days of battery life,” unfettered those on the go from power outlets. Continue reading Qualcomm All-In on Copilot+ PCs Boosting Speed, Battery Life

Nvidia President and CEO Jensen Huang said the company will be upgrading its AI accelerators annually, with the Blackwell Ultra processor coming in 2025 and a next-generation platform called Rubin that is still in development planned for 2026. Rubin AI will utilize a type of high-bandwidth memory called HBM4 that addresses a bottleneck that has stifled the production of AI accelerators. Huang shared the news from Taiwan, where he delivered a keynote at the Computex trade show. Nvidia Inference Microservices were another focus, allowing AI applications to be deployed in minutes instead of weeks, Huang said. Continue reading Nvidia Teases Next-Gen AI Platform Rubin at Computex 2024

At Computex Taipei this week, AMD revealed its AMD Ryzen AI 300 Series third generation of AI-enabled mobile processors for next-generation laptops. It joins Intel’s upcoming Lunar Lake and the Snapdragon X platform from Qualcomm among the chips vying for a place in the exploding market for artificial intelligence processing, an area dominated by Nvidia. However, with AI PCs and laptops just hitting the market that field is somewhat in play. The Ryzen AI 300s are among those that will be used to power laptops equipped with Microsoft Copilot+ AI. At Computex, AMD also unveiled its Ryzen 9000 Series processors for desktop PCs. Continue reading AMD Unveils Its Next-Gen AI Chips in Battle for Market Share

Nvidia CEO Jensen Huang’s keynote at Computex Taipei marked the official launch of the company’s Grace Hopper Superchip, a breakthrough in accelerated processing, designed for giant-scale AI and high-performance computing applications. Huang also raised the curtain on Nvidia’s new supercomputer, the DGX GH200, which connects 256 Hopper chips into a single data-center-sized GPU with 144 terabytes of scalable shared memory to build massive AI models at the enterprise level. Google, Meta and Microsoft are among the first in line to gain access to the DGX GH200, positioned as “a blueprint for future hyperscale generative AI infrastructure.” Continue reading Nvidia Announces a Wide Range of AI Initiatives at Computex

Intel is developing its Honeycomb Glacier to bring two-screen PCs to gamers. The primary panel is 15.6-inch 1080p; the secondary one is 12.3-inch 1920×720. Up until now, laptops with a secondary screen have been uncomfortable and awkward to use, but the Honeycomb Glacier resolves that problem by using a double hinge to lift both screens into the air. The lifted screen automatically stays in the angle chosen by the user due to a mechanical one-way roller clutch. A button on the left side disengages it. Continue reading Intel‘s Sneak Peek of Innovative Two-Screen PC for Gamers

At Computex in Taipei this week, Intel held a Technology Open House and debuted its 10th generation Intel Core processors and prototype devices that combine ambient computing, artificial intelligence and modular computing. Project Athena to bring AI to the PC was also on display, and the company unveiled its Intel NUC Compute Element, available for several processors. Intel corporate vice president of client engineering Jim Johnson stressed that the company is putting “a new class of compute performance and intelligence in people’s hands.” Continue reading Intel Combines Ambient Computing, AI, Modular Computing

Nvidia’s new EGX Platform will bring AI computing to the edge, meaning it will take place at the sensors, before being sent to cloud-based data centers. The platform is intended to handle the immense growth in sensors embedded in Internet of Things devices and wearables, which has resulted in a massive amount of raw data. According to Nvidia senior director of enterprise and edge computing Justin Boitano, “we will soon hit a crossover point where there is more computing power at the edge than in data centers.” Continue reading Nvidia EGX Brings AI Computing to the Edge, Enabling IoT

At Computex 2018, Asus announced its ROG (Republic of Gamers) Phone, with gamer-oriented design and a 90Hz display, which means the screen refreshes 90 times per second for smoother animation. The ROG Phone will compete with the Razer Phone, another mobile device prized by gamers. Asus ups the ante by adding a “specially selected 2.96GHz Qualcomm Snapdragon 845 chip” to each ROG Phone, ensuring it will be the speediest one around. The phone also offers vapor cooling and a special attachable fan accessory. Continue reading Asus Introduces ROG Phone Optimized for Hardcore Gamers

At Computex 2017, Microsoft exhibited Windows Mixed Reality headsets from Asus, Dell and Lenovo, weeks after showing headsets from HP and Acer. Asus, which collaborated with Microsoft to ensure speed and power, displayed a headset with a polygonal cover panel. Dell’s headset, designed by the team that made its high-end XPS and Alienware PCs, is being marketed as offering an affordable price, customizable cushioning, a flip-up visor and convenient cable routing. Lenovo’s headset is positioned as the least expensive. Continue reading Asus, Dell, Lenovo Unveil Windows Mixed Reality Headsets

At the Computex trade show in Taiwan, San Diego-based Qualcomm introduced new chips for connected landlines, wireless Wi-Fi networks and wearables. To expand broadband communications network capacity, the company’s Atheros business unveiled GigaDSL chips that let broadband operators transition away from VDSL technology to Gigabit access. The company is also debuting a three-way radio chip to be used for Wi-Fi wireless data networking as well as a new set of Snapdragon Wear chips for wearable devices. Continue reading Qualcomm Debuts Chips for Broadband, Wi-Fi and Wearables

From desktops, laptops and tablets to game consoles and other CE devices, the Universal Serial Bus has been the industry standard for cable and connection interfaces for about 20 years. It has been speculated that USB-C, developed by the USB Implementers Forum, would soon become the successor to the USB standard. Intel announced during Computex in Taiwan last week that Thunderbolt 3 will embrace USB-C functionality, and initially offer data transfer rates twice as fast as Thunderbolt 2 and four times that of USB 3.1. Teaming the two could be a game-changer. Continue reading Thunderbolt Adopts USB-C, Universal Port of the Near Future

Intel believes that the wireless display and charging features of its next-generation Skylake platform will soon result in Intel reference designs that will eliminate all cables from personal computers. During Computex, the chipmaker detailed how docking, wireless power and connectivity will form the foundation of its post-Broadwell reference designs. Skylake is expected by the second half of next year, suggesting that devices based on Intel’s designs would hit the market as soon as 2016. Continue reading Intel Looks to Eliminate PC Cables with its Skylake Platform

At the Computex trade show in Taiwan, Intel is showing prototypes of convertible, “2-in-1” devices that have elements of both tablets and PCs. One design is an extremely thin PC-tablet with a 12.5-inch display that works both with or without a keyboard. The 7.2-millimeter thick device runs on Windows 8.1 software, and it is expected to go to market in time for this year’s holiday season. The compact design of the ultrathin PC-tablet is made possible by the small circuits in Intel’s Broadwell processing chips. Continue reading Intel’s PC-Tablet Hybrid is Powered by New Innovative Chips