Huawei, in partnership with Taiwan Semiconductor Manufacturing Company (TSMC), debuted the Kirin 980, the first mobile chip fabricated on a 7nm process. The Kirin 980 features 6.9 billion onboard transistors, about 1.6 times the number on the Kirin 970, while shrinking the die size down from 10nm. The result offers a 40 percent reduction in power consumption, and a 20 percent improvement in several processing metrics. That feat took 1,000 senior engineers three years and more than 5,000 prototypes to achieve success. Continue reading Huawei Kirin 980: First 7nm Mobile Chip Amps Up Processing