Ten years ago AMD introduced the concept of smaller, interconnected chips that together work like one digital brain. Sometimes called “chiplets,” they’re generally less expensive than building one large chip, and when grouped together into bundles have often outperformed single wafters. In addition to AMD, companies including Apple, Amazon, Intel, IBM and Tesla have embraced the chiplet formula, which leverages advanced packaging technology, an integral part of building advanced semiconductors. Now experts are predicting packaging is going to be even more of a focus in coming years, as the global chip wars heat up. Continue reading Advanced Packaging for ‘Chiplets’ a Focus of CHIPS Funding

Taiwan’s TSMC, the largest semiconductor manufacturer in the world, is seeking $15 billion in U.S. subsidies to help build two chip factories in Arizona, but is pushing back against terms that include sharing detailed information about its stateside operations and possibly profits. Some South Korean semiconductor firms are also said to have raised objections. The White House contends the criteria are in place to protect American taxpayers and ensure the subsidies are being spent as intended. TSMC has pledged $40 billion of its own funds for the project. Continue reading TSMC Seeks $15 Billion in U.S. Incentives to Build Foundries

Japan decided last week to join the U.S. and Netherlands in limiting exports of chipmaking gear to China. As early as July, suppliers of 23 types of chip technology will need a government sign-off to export to countries including China, which has been struggling to build a domestic chip industry. Japanese companies impacted by the restrictions include Tokyo Electron, Lasertec, Nikon Corp. and Screen Holdings, according to the Japanese trade ministry. The central goal of the clampdown is to make it harder for Chinese firms to produce advanced chips for artificial intelligence. Continue reading Japan, U.S., Netherlands Seek to Limit China’s Chip Industry

Epic Games introduced Unreal Engine 5.2 at GDC 2023, demonstrating new levels of photorealism and physics designed to facilitate the creation of real-time interactive worlds for the metaverse. Procedural content generation tools and a material framework called Substrate for intricate surfaces with detailed refraction and reflection are new to the 5.2 preview build, available now at the Unreal Engine Marketplace and on GitHub. The economy around Unreal Editor for “Fortnite” has expanded to include a new revenue-sharing plan that lets creators keep 40 percent of funds generated from “islands” they create for the popular game. Continue reading Epic Debuts Unreal 5.2 and Expands ‘Fortnite’ Profit-Sharing

The U.S. plan to expand its national chip industry includes adding a minimum of two manufacturing clusters for advanced semiconductors by 2030. Commerce Secretary Gina Raimondo explained Thursday that the goal is to create chip ecosystems that group together fabrication plants, assembly plants, research-and-development labs and the suppliers to support each phase of operation. The vision is to make the U.S. “the only country in the world where every company capable of producing leading edge chips will have a significant R&D and high-volume manufacturing presence,” Raimondo said. Continue reading U.S. Plans to Create Manufacturing Clusters with CHIPS Act

During Samsung’s Galaxy Unpacked event in San Francisco, the company introduced its $1,200 Galaxy S23 Ultra smartphone, featuring a 200-megapixel camera sensor, an updated form factor, a Snapdragon 8 Gen 2 processor, and major jump in storage. Samsung also announced updated Galaxy S23 and S23 Plus models with the same floating camera design of the S23 Ultra and pricing that matches last year’s offerings. The company’s new Galaxy Book3 Ultra laptop touts a 16-inch, 120Hz OLED screen and offers an Intel H-Series Core i7 or Core i9 processor and an Nvidia RTX 4050 or 4070 GPU. The Book3 line features Samsung’s Dynamic AMOLED 2X display and an Nvidia RTX 3070 GPU. Continue reading Samsung Unveils Smartphones, Laptops at Unpacked Event

Memory chip prices have plummeted this past year, with continued declines expected through Q2. The painful supply chain shortages of 2020 have been replaced, in many instances, by inventory gluts, with some chipmakers talking about scaling back expansion plans. The average price for memory chips used in consumer electronics — from TV sets to smartphones and personal computers — are expected to dip by double-digits in Q1, analysts say. In 2022, prices declined by 20 percent starting in Q2. TrendForce predicts inflation and high interest rates will continue to suppress corporate and consumer spending on electronic devices, including data servers. Continue reading Manufacturers Are Impacted by Sagging Memory Chip Prices

Apple has announced new 14- and 16-inch iterations of its MacBook Pro laptops, featuring Apple’s next-generation silicon. The M2 Pro and M2 Max chips turn the MacBook Pro into a portable workstation, able to tackle demanding tasks like effects rendering and color grading. Apple is promising up to 22 hours of battery life, the most ever in a Mac. The smaller model starts at $1,999, while entry level for the 16-inch is $2,499. Pre-orders began last week and delivery starts tomorrow. Apple is also releasing an updated Mac mini with M2 ($599) or M2 Pro ($1,299) chips. Continue reading Apple Debuts MacBook Pros with M2 Pro and M2 Max Chips

At CES 2023, Asus refreshed this year’s models of its popular ROG Zephyrus gaming laptops. The new flagship M16 comes tricked out with 13th Gen Intel i9 and Nvidia RTX 4090 graphics. The RTX 4080 variant starts at $3,900. Also arriving in the first quarter of 2023 are updates on the G14 and ROG Zephyrus Duo 16, with options including AMD Ryzen 9 Zen 4 or 13th Gen Intel processors and Nvidia GeForce RTX 40 Series GPUs. On the display front Asus offers the ROG Nebula, powered by mini-LED powered Nebula HDRs. Next-gen cooling rounds out the package. Continue reading CES: Asus Upgrades Popular ROG Zephyrus Gaming Laptops

Samsung Display has debuted a concept mobile device that both folds and slides, the Flex Hybrid. The company’s “smart mobile device” prototype unfolds to reveal a display on the left side, with the right side sliding outward to expand screen real estate. The Flex Hybrid’s OLED screen expands from a 10.5-inch 4:3 configuration to a 12.4-inch 16:10 display. Samsung Display also previewed two larger displays at CES 2023, the Flex Slidable Solo, which expands in a single direction, and the Flex Slidable Duet, which grows on both sides, from 13 or 14 inches of screen space to 17.3 inches. Continue reading CES: Samsung Flex Hybrid Mobile Device Can Fold and Slide

LG is injecting some glitz into its flagship laptops with the introduction of its Gram Style line of glass case iridescent portables. The LG Gram Style comes in 14- and 16-inch configurations, and like the featherweight gray units that came before them are slim and lightweight. The main distinction is the luminous, color-changing finish that LG says will “shine and shift dynamically, moving and changing depending on the light and angle,” with more exotic color variations in the pipeline. LG was displaying various patterned Gram Style lids at its CES booth in purples, pinks, polka dots and more, asking visitors to vote their favorites, with the winner said to be coming to market. Continue reading CES: 2023 LG Laptops Include Gram Style in Iridescent Glass

HP is targeting the prosumer market with an offshoot of its Elite Dragonfly business line, introducing the Dragonfly Pro Windows laptop and Dragonfly Pro Chromebook at CES 2023. Targeting freelancers, creators and hybrid workers, the aim is to simplify purchasing choices by offering basic configurations and limited customization. ”HP is taking the headache out of hybrid by delivering powerful and best-in-class ecosystem experiences,” said Alex Cho, president, personal systems, HP Inc. By 2027 freelancers will account for more than 50 percent of the total U.S. workforce, HP projects. Continue reading CES: HP Designs Dragonfly Pro Laptops for Hybrid Workforce

Intel announced its 13th-gen family of laptop CPUs, including new entry-level chips and its flagship Core i9-13980HX, the high-end of its mobile processor collection (based on Raptor Lake architecture), featuring 24 cores and an impressive boost speed of 5.6GHz. The HX-series includes similar features to Intel’s 12th-gen lineup, such as 32 EUs of onboard graphics capability and support for DDR5 and DDR4, but promises significantly faster speeds to multithreaded performance. When compared to the earlier Core i9-12900HK, Intel claims game performance increases of up to 12 percent and a massive 74–79 performance jump when rendering a scene in Blender. Continue reading CES: Intel Rolls Out 13th-Generation Lineup of Laptop CPUs

TSMC has revised plans for its Arizona chip plant, reportedly the result of pressure from customers including Apple, Nvidia and AMD, who urged the Taiwanese company to reconsider its plan to output 5-nanometer processors that will be old news by the time the $12 billion plant opens in 2024. TSMC is expected to announce during a scheduled Tuesday visit by President Biden and Commerce Secretary Gina Raimondo that it will output advanced 4-nanometer chips when production commences and will add a second nearby plant to manufacture even more sophisticated 3-nanometer chips. Continue reading TSMC’s Advanced Chipmaking Plans Leak Before Biden Visit

Amazon Web Services, a leading provider of cloud computing services, is rolling out its new ARM-based Graviton3E chips for high-performance workloads, including tasks like weather forecasting and gene sequencing. AWS customers can rent the high-performance computing (HPC) power to take advantage of “performance gains and cost savings” as a result of making its own chips, Amazon says. The move makes AWS something of a competitor to other top chipmakers, including Intel, AMD and Nvidia, who continue to be among Amazon’s major chip suppliers. Amazon says it will continue to offer HPC services that rely on third-party chips. Continue reading AWS Touts HPC with Launch of Graviton3E Chip at re:Invent