Rene Haas, CEO of UK chip designer Arm Holdings, thinks his company’s platform architecture could nab as much as 50 percent of the Windows PC market by 2030. That would essentially be a 400 percent leap from its current 11 percent share in a market dominated by Intel’s x86 design. Because Arm was developed for smartphones, it was driven by energy efficiency, an approach that is paying off in the era of power-hungry AI applications. Now the technology is being used for the first wave of Microsoft Copilot+ Windows laptops, and Arm has also set its sights on desktop PCs. Continue reading Arm CEO Says Company Aims to Capture Half of PC Market

Intel launched new Xeon 6 processors built for high-density AI work in data centers. Intel CEO Pat Gelsinger emphasized performance and power efficiency as he introduced the next-gen Xeon, and said that the Gaudi 3 chips for AI model training and deployment that were released two months ago are less expensive than comparable silicon from Intel rivals. “Intel is one of the only companies in the world innovating across the full spectrum of the AI market opportunity — from semiconductor manufacturing to PC, network, edge and data center systems,” Gelsinger said, embracing open standards during his keynote at Computex. Continue reading Intel’s Xeon 6 Coming to Data Centers and Lunar Lake to PCs

At Computex Taipei this week, AMD revealed its AMD Ryzen AI 300 Series third generation of AI-enabled mobile processors for next-generation laptops. It joins Intel’s upcoming Lunar Lake and the Snapdragon X platform from Qualcomm among the chips vying for a place in the exploding market for artificial intelligence processing, an area dominated by Nvidia. However, with AI PCs and laptops just hitting the market that field is somewhat in play. The Ryzen AI 300s are among those that will be used to power laptops equipped with Microsoft Copilot+ AI. At Computex, AMD also unveiled its Ryzen 9000 Series processors for desktop PCs. Continue reading AMD Unveils Its Next-Gen AI Chips in Battle for Market Share

Intel Innovation 2023 provided a springboard for the new Core Ultra generation of chips, known as “Meteor Lake,” which uses the new Intel 4 process and is also the first series to feature a dedicated AI coprocessor, shipping December 14. Intel confirmed its “five-nodes-in-four-years” process technology plan is on schedule. Intel CEO Pat Gelsinger’s keynote demos included “Pike Creek,” introduced as “the world’s first multi-chiplet package using Universal Chiplet Interconnect Express (UCIe) interconnects.” For all that, it was AI that took center stage at the 2-day event in San Jose. Continue reading Intel Touts AI and Debuts New Chip Tech at Innovation Event