Canon is gearing up to begin shipping its new nanoimprint lithography chipmaking machines, possibly this year. The equipment — which uses a stamping process Canon says will be cheaper and more energy-efficient than ASML’s light-based extreme ultraviolet (EUV) technology — could be a disruptor in a market dominated by the Dutch company. Such machines, essential in manufacturing semiconductors, imprint circuitry onto silicon wafers in patterns that can be thousands of times thinner than the width of a human hair. Foundries TSMC, Samsung Semiconductor and Intel rely on ASML’s EUV machines in the manufacture of high-end chips. Continue reading Canon Could Begin Shipping Chip Stamping Machine in 2024

Canon has made a breakthrough it says can help manufacture the world’s most advanced semiconductors. The company’s latest nanoimprint lithography (NIL) system challenges Dutch firm ASML, to date the leader in extreme ultraviolet (EUV) lithography technology. ASML creates tech used in TSMC’s chips made for Apple iPhones. Canon says its FPA-1200NZ2C nanoimprint semiconductor manufacturing equipment can produce chips equivalent to a 5-nanometer process, the current state of the art, and with further improvement expects to enable circuit patterning corresponds to 2nm nodes. The new equipment is also energy efficient, Canon says. Continue reading Canon Litho Breakthrough May Advance Global Chipmaking