Intel has unveiled a new glass substrate technology that it says will “benefit our key players and foundry customers for decades to come.” The result of 10 years and $1 billion in development, the concept substitutes glass for the usual resin in which processors are embedded, enabling greater speed and the ability to accommodate the industry’s move toward packaging numerous “chiplets” into more powerful large processors, a configuration that has proven beneficial for the acceleration that drives artificial intelligence. This technology could potentially vault Intel ahead of competitors, some say. Continue reading Intel Has Plans to Power AI with Glass Substrates for Its Chips

Ten years ago AMD introduced the concept of smaller, interconnected chips that together work like one digital brain. Sometimes called “chiplets,” they’re generally less expensive than building one large chip, and when grouped together into bundles have often outperformed single wafters. In addition to AMD, companies including Apple, Amazon, Intel, IBM and Tesla have embraced the chiplet formula, which leverages advanced packaging technology, an integral part of building advanced semiconductors. Now experts are predicting packaging is going to be even more of a focus in coming years, as the global chip wars heat up. Continue reading Advanced Packaging for ‘Chiplets’ a Focus of CHIPS Funding

Intel is taking on Nvidia and AMD with its Max Series for high performance computing and artificial intelligence. The company unveiled two products under the Max umbrella: the Intel Xeon Max CPU and the Intel Data Center Max Series GPU. The Max GPU is Intel’s highest density processor, packing over 100 billion transistors into a 47-tile package with up to 128GB of high-bandwidth memory. The oneAPI open software ecosystem provides a single programming environment for both new processors, with Intel’s 2023 oneAPI and AI tools enabling the Intel Max Series products’ advanced features. Continue reading Intel Targets Supercomputing with New Max Series CPU, GPU

Intel announced the consumer GPU brand Arc last year, which the company now says will begin delivering in Q4. The Arc A770 Limited Edition desktop gaming card will be available October 12, starting at $329, “the sweet spot of desktop graphics,” according to CEO Pat Gelsinger, who said the GPU “delivers 65 percent better peak performance versus competition on ray tracing.” Intel says other new GPU models, including the Arc Pro A30M for mobile unveiled last month at SIGGRAPH, will also come to market by the end of the year. The new GPUs feature built-in ray tracing hardware, machine learning capabilities and industry-first AV1 hardware encoding acceleration. Continue reading New GPUs Showcased at Intel’s Innovation Developer Event

Intel has raised a red flag regarding the metaverse, warning that more processing power is needed to support the vision. “Immersive computing, at scale and accessible by billions of humans in real time” will require a 1,000x increase in computational capability from today’s state of the art, says Intel senior vice president Raja Koduri, general manager of the company’s Accelerated Computing Systems and Graphics Group. Intel remains enthusiastic about the metaverse, however, conceding in the company’s first official statement on the matter it “may be the next major platform in computing after the world wide web and mobile.” Continue reading Intel Says the Metaverse Needs 1,000x More Compute Power