The RayNeo X2 Lite 3D AR glasses were demonstrated for the first time at CES 2024 in Las Vegas last week. Weighing just 60 grams (2.1 ounces), the sleek eyewear was lauded for its microLED optical waveguide display and standalone form factor, which does not require tethering to a computer or smartphone. The RayNeo X2 Lite, releasing in Q3 2024, and the Ray Neo X2, which had a limited launch in China but has not yet been released to the rest of the world, are anticipated as the first microLED display augmented reality glasses which will be available in the United States. Continue reading CES: TCL Demos RayNeo X2 Lite Augmented Reality Glasses

During this week’s Unpacked event, Samsung introduced Galaxy AI, a suite of artificial intelligence tools designed for the new Galaxy S series smartphones — the Galaxy S24, Galaxy S24+, and Galaxy S24 Ultra. “AI amplifies nearly every experience on the Galaxy S24 series,” including real-time text and call translations, a powerful suite of creative tools in the ProVisual Engine and a new kind of “gestural search that lets users circle, highlight, scribble on or tap anything onscreen” to see related search results. The AI enhancements are largely enabled by a multiyear deal with Google and Qualcomm. Samsung also debuted a wearable accessory, the Galaxy Ring. Continue reading Unpacked: Samsung Intros Galaxy AI with Next Gen S Phones

Sony Corporation debuted a mixed reality headset “aimed at supporting creators in sophisticated 3D content creation.” The Sony XR HMD includes “an XR head-mounted display with 4K OLED Microdisplays and Sony’s proprietary rendering technology” to enable real-time, high-definition “rendering of textures of 3D objects and facial expressions of human characters,” Sony announced at CES. The electronics giant disclosed plans to “collaborate with developers” of 3D production software, “including in the entertainment and industrial design fields.” At launch, Sony is exclusively partnered with Siemens to develop a collaborative product design solution. Continue reading CES: Sony’s Mixed-Reality Headset Built for Content Creation

Las Vegas becomes the global center of technology and innovation as more than 130,00 attendees, business leaders, and over 4,000 exhibitors arrive for the start of CES 2024, January 9-12. Across more than 2.5 million square feet of exhibit space and 250 conference sessions, the ETC@USC team of reporters and analysts will cover stories of greatest interest, importance, and potential impact to the future of media and entertainment. Smart TVs and next-gen displays; the latest in processor upgrades; AR, VR and XR; security; mobility and robotics are among the themes we expect to take center stage, all of which will be tied in one way or another to AI. Continue reading CES 2024 Expects 130,000 Attendees and 4,000+ Exhibitors

Qualcomm’s Snapdragon XR2+ Gen 2 chip for extended reality platforms is designed to allow those who incorporate it into their gear to give Apple’s ambitious and technologically advanced Vision Pro headset a run for its money. Qualcomm says as part of the second gen Plus launch announcement that Samsung and Google have committed to using its new chip to power gen two XR experiences. Among the noteworthy XR2+ features is its single-chip architecture for 4.3K spatial computing at 90 frames per second. It supports 4.3K per eye resolution and 12 or more concurrent cameras to VR and mixed reality experiences. Continue reading CES: Qualcomm Chip Enables Faster Mixed Reality Features

Satellite television pioneer Charlie Ergen has reunited his empire, having on December 31 completed the merger of Dish Network Corp. and EchoStar Corp. Ergen co-founded both companies and served as chairman of each prior to the merger. He now becomes executive chairman of the combined operation. Former EchoStar chief Hamid Akhavan was named president and CEO of the two companies in November and continues as operational head. Ergen feels his satellite infrastructure is well-situated for 5G. He plans to move the unified firm away from pay TV and into wireless services, competing with Verizon, T-Mobile and AT&T. Continue reading Ergen Completes Dish Merger with EchoStar for 5G Moonshot

Intel formally launched its new Core Ultra CPUs and related products this week at its AI Everywhere event. The company shared new solutions ranging from the data center to the cloud edge and PC. Intel’s new mobile processors are part of its Meteor Lake lineup, all of which will now bear the Ultra imprimatur instead of the “I,” promising greater power efficiency and performance. At the New York City event, Intel CEO Pat Gelsinger said “AI innovation is poised to raise the digital economy’s impact up to as much as one-third of global gross domestic product.” Continue reading Intel Unveils AI-Driven Chips to Compete with Nvidia and AMD

Former Apple designers Imran Chaudhri and Bethany Bongiorno last week officially launched the Humane Ai Pin they’re positioning as a smartphone replacement. The $700 wearable magnetically attaches to clothing. A $24 per month T-Mobile data subscription is required for connectivity. Described as “a download device and software platform built from the ground up for AI,” it’s got an ultra-wide RGB camera, depth sensors and motion sensors, and a speaker that creates “a bubble of sound” that can be loud or soft. Preorders for the Ai Pin begin November 16, with shipments scheduled to begin in early 2024. Continue reading Humane’s $700 Ai Pin Is Positioned to Replace Smartphones

Qualcomm has debuted a new flagship platform, the Snapdragon X Elite series. Built for artificial intelligence and capable of running generative models with over 13 billion parameters, Qualcomm claims it offers “4.5 times faster AI processing power than competitors.” Described as “the most powerful computing processor it has ever created for the PC,” Qualcomm says the chipset is also one of the most efficient, “with up to multiple days of battery life.” Leading OEMs are expected to begin shipping models with the new processors in mid-2024. Continue reading Qualcomm Unveils Snapdragon X Elite Series, Created for AI

Not content with dominating what is currently the hottest processor market in the world — chipsets for artificial intelligence — and leading among GPU suppliers, Nvidia is branching into CPUs. The 30-year-old company, whose market cap passed the $1 trillion mark in May, is said to be “quietly” developing chips to run Microsoft’s Windows OS, tapping into a global market that hovers at about 300 million PC sales per year, 70 percent of which use Windows, according to Statista. Nvidia is reportedly pursuing its plan via a licensing deal with Arm, whose tech powers 200 billion mobile processors shipped each year. Continue reading Nvidia to Pursue Mobile and PC Markets with Arm Processors

The name ‘X’ may have received an icy welcome as a social media platform, but Qualcomm is snapping it up with a new line of PC chips called the Snapdragon X series. The “all-new naming architecture” describes a chip anchored by the Qualcomm Oryon CPU, which when combined with its neural processing unit (NPU) will deliver what the company says will be “next-level performance, AI, connectivity and battery life.” The move positions Qualcomm to take on Apple in the bid for AI super chips. Qualcomm acquired the Oryon tech with its 2021 acquisition of Nuvia, founded by former Apple engineers. Continue reading Qualcomm Teases Its Soon-to-Launch Snapdragon X Series

Europe is moving forward in the supercomputer space, with two new exascale machines set to come online. Jupiter will be installed at the Jülich Supercomputing Centre in Munich, with assembly set to start as early as Q1 2024. Scotland will be home to the UK’s first exascale supercomputer, to be hosted at the University of Edinburgh, with installation commencing in 2025. An exascale supercomputer can run calculations at speeds of one exaflop (1,000 petaflops) or greater. On completion, these two new supercomputers will land in the top percent of the world’s high-performers. Continue reading Germany, UK to Host Europe’s First Exascale Supercomputers

At yesterday’s Samsung Developer Conference in San Francisco, South Korea’s number one smartphone exporter unveiled new additions to its Galaxy ecosystem: the Galaxy S23 FE model phones, the Galaxy Tab S9 FE and S9 FE+, and Galaxy Buds FE. These latest additions to the flagship Galaxy line are designed to provide a pro-level camera as well as smooth mobile gaming performance. Complete with AI editing tools for easy-share content, the Galaxy S23 FE is also customizable, with Pro Mode controls that allow manual selection for shutter speed, aperture and ISO for those who choose. Continue reading Samsung Showcases the Latest Additions to Its Galaxy Lines

New devices to make life easier and more stylish in the home and on the go debuted at yesterday’s Made by Google event. The AI-powered Pixel 8 and Pixel 8 Pro smartphones took center stage, packed with a Tensor G3 chipset. Event co-stars included the Pixel Watch 2, also with a processor upgrade — in this case, Qualcomm’s Snapdragon W5. Google’s Pixel Buds Pro got a makeover with two new colors: light blue and porcelain. The Pixel Fold and talk of the upcoming experimental launch of Google Home AI and Google Assistant with Bard were other highlights. Continue reading Google Unveils Creative AI Features for Its Pixel 8 Phone Line

Key highlights from this week’s two-day Meta Connect virtual event include details about the Quest 3 mixed reality headset, the latest smart glasses from its Ray-Ban collaboration, and an announcement that AI stickers are rolling out across the Meta Platforms apps. Starting at $500, the Meta Quest 3 will add Microsoft 365 apps integration by the end of the year, for those who want to use the gaming headset for productivity. Available for preorder now, the Quest 3 ships October 10. The Ray-Ban Meta smart glasses start at $299 and ship October 17. Continue reading Meta Shows Off Quest 3 and Smart Glasses at Connect 2023