The Rise of Specialized Computing and New Era of Chip Design

Moore’s Law, which states that the number of transistors in a chip doubles approximately every two years, is sputtering to an end. As a result, an increasing number of companies are relying on specialized computing, which transforms software tasks into silicon chips rather than relying on CPUs. This key technology is behind two recent developments: Intel’s acquisition of Israeli startup Mobileye, which produces chips and software for autonomous vehicles, and Nvidia’s latest iteration of a system to speed up machine learning. Continue reading The Rise of Specialized Computing and New Era of Chip Design

Qualcomm Agrees to Buy NXP Semiconductors for $39 Billion

Qualcomm, known for its mobile processors and wireless modems, has agreed to purchase NXP Semiconductors for $39 billion. Including debt, the acquisition is valued at $47 billion, representing the largest semiconductor deal to date. The agreement exceeds the Avago Technologies $37 billion deal to buy Broadcom Corp. In terms of pure tech deals, the agreement lands behind only Dell’s $60 billion purchase of EMC. Dutch company NXP, formerly Philips Semiconductors, is a leader in the growing automotive-chip market, and Qualcomm wants to supply its chips for autonomous vehicles. Continue reading Qualcomm Agrees to Buy NXP Semiconductors for $39 Billion

Samsung Works to Stay Atop Competitive Smartphone Market

Top smartphone maker Samsung Electronics lost global market share for the first time in four years, falling to 31.2 percent of the market. Samsung’s profit margin on smartphones remained at the same 19.8 percent from last year, but the rising costs of smartphone component parts will make it difficult to maintain the same profits. Meanwhile, Apple’s market shares are also slipping, as affordable alternatives from Lenovo and Huawei are on the rise in the smartphone market. Continue reading Samsung Works to Stay Atop Competitive Smartphone Market

Innovation: IBM and 3M to Jointly Develop Super-Fast 3D Semiconductors

  • IBM and 3M have announced they will partner to build 100 layer silicon towers that promise a “computer chip 1,000 times faster than today’s fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.”
  • “That’s a heady claim for a tech that doesn’t yet exist, but is already taking swings at current faux 3D transistors,” comments Engadget.
  • Under the agreement, IBM will provide its experience in packaging the new processors, while 3M will develop an adhesive that can be applied in batches and allow for heat transfer without damaging logic circuitry.
  • If successful, the companies would create commercial microprocessors composed of layers of up to 100 chips. According to the press release: “Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a ‘brick’ of silicon… The companies’ work can potentially leapfrog today’s current attempts at stacking chips vertically – known as 3D packaging.”