Ten years ago AMD introduced the concept of smaller, interconnected chips that together work like one digital brain. Sometimes called “chiplets,” they’re generally less expensive than building one large chip, and when grouped together into bundles have often outperformed single wafters. In addition to AMD, companies including Apple, Amazon, Intel, IBM and Tesla have embraced the chiplet formula, which leverages advanced packaging technology, an integral part of building advanced semiconductors. Now experts are predicting packaging is going to be even more of a focus in coming years, as the global chip wars heat up. Continue reading Advanced Packaging for ‘Chiplets’ a Focus of CHIPS Funding