TSMC introduced its new logic process technology, A14, at the company’s North America Technology Symposium in California. Designed to drive AI forward with faster computing and greater power efficiency, the 1.4nm A14 process is expected to be a boon to smartphones, expanding their on-board capabilities. The company says A14 is an improvement over TSMC’s N2 2nm node, set to go into volume production later this year. TSMC plans to begin producing chips using the A14 process in 2028 for AI clients including Nvidia, the company told reporters and analysts on the eve of its conference.

“The company said the new node relies on its 2nd generation gate-all-around (GAA) nanosheet transistors and will offer further flexibility with NanoFlex Pro technology,” Tom’s Hardware reports. “TSMC expects A14 to enter mass production in 2028 — but without backside power delivery. A version of A14 with backside power delivery is planned for 2029.”

In a news release, TSMC indicates the new process will make smartphones “even smarter,” adding that “the current A14 development is progressing smoothly with yield performance ahead of schedule.”

The company claims A14 will offer up to 15 percent speed improvement at the same power, or up to 30 percent power reduction at the same speed, along with more than 20 percent increase in logic density.

“TSMC’s cutting-edge logic technologies like A14 are part of a comprehensive suite of solutions that connect the physical and digital worlds to unleash our customers’ innovation for advancing the AI future,” TSMC CEO C.C. Wei said in the announcement.

The company believes the A14 process “could power new devices like smart glasses, potentially overtaking smartphones as the largest consumer electronics device by shipments,” according to remarks at the event reported by EE Times.

In addition to A14, TSMC also debuted new 3D stacking for chips and other technologies that in addition to smartphones aim to drive high performance computing (HPC), automotive and the Internet of Things (IoT).